Saturday, 31 October 2015

Intel’s 3D XPoint Memory Performance Tested, Up to 8X Performance Increase Over Conventional SSDs – To Be Featured on Optane SSDs and Optane DIMMs

A few months ago, chip-giant Intel announced their latest 3D XPoint memory which shook the market as a whole. Featuring unprecedented levels of performance, the 3D XPoint memory will be available in market during next year and will revolutionize the tech industry with the latest 3D XPoint based Optane SSDs and DIMMs.
Intel 3D XPoint Optane SSD Performance
Image Credits/Source: ThePlatform

Intel’s 3D XPoint Performance Revealed – Coming in 2016 With Optane SSDs and Optane DIMMs

For several years, we have been anticipating a revolutionary product from tech giant Intel and while they are primarily known for their processors, Intel brought their revolution with the new 3D XPoint memory standard which can work as both, DRAM and Flash. Focused at consumers, data center and workstation markets, Intel’s latest memory standard will be 1000 times faster than NANA, 10 times denser than DRAM and will have 1000 times the durability of NAND. While one would guess a insanely high price for these new products, Intel has promised a suggested pricing comparable to current flash and DRAM products which will mean that Optane branded products will become economically viable to gain a larger user base when its launched due to high competitive pricing.
During the OpenWorld conference, ThePlatform managed to get some details of 3D XPoint from Intel’s keynote where the CEO of Intel, Brian Krzanich, emphasized the need to evolve the memory hierarchy. Currently, HDDs have been pushed to their limits and SSDs are only getting better but when we look at a modern PC, we look at multi-core processors and keeping them fed is a big challenge for Intel. Optane SSDs fill in the equation and on the performance side, push things in the upward direction while putting balance back to I/O, compute and the storage so that modern processors can unleash their true performance. When looking at overall PCs, Intel has not moved beyond four cores on their mainstream processors and that might change with the emergence of high-performance storage devices and better I/O systems being introduced inside the PC environment.
Intel Optane Tech
Now here is the interesting thing. Optane based memory devices arent just for storage, they will be available in the DIMM format as well. Infact, they will be available for everything from Datacentres to Ultrabooks and while the mainstream niche will most probably be interested in them as a storage memory standard, their versatility enables them to be used in the DIMM format as well for Xeons. The Optane SSD that was demoed at Intel Developer Forum 2015 back in June, was a PCIe based device that was pit against the Intel P3700 SSD (which is the best offering in conventional SSD storage Intel has right now).
Image Credits/Source: ThePlatform
Today, Intel previewed the performance of their Optane SSDs once more against the P7300 NAND Flash SSD and the result was a 3D XPoint based NVMe SSD delivering 4.42x better IOPS performance (15,900 vs 70,300) and 6.44 times lower latency (58ms vs 9ms). Later, Intel also revealed the performance results using Oracle as the base system software running and the performance gap widened with the 3D XPoint SSD performing 7.13x faster in IOPS throughput (13,400 vs 95,600) and delivering 8.11x lower latency (73ms vs 9ms).
  • The Optane SSD was able to achieve 7.2x times more IOPS at low queue depth and upto 5.21 times the IOPs of conventional SSDs at high queue depths.
  • An Optane Technology based SSD has 10x times the density of conventional SSD drives.
  • The marketing material also claims it is 1000x faster than the competition available on the market but it isn’t clear to what exactly they are referring to – a good guess would be latency, as opposed to bandwidth.
  • Optane SSDs will have 1000x the endurance – which, if true, should mean the device has virtually unlimited life span for practical purposes.
All Optane based devices will feature a cross point array structure, which consists of perpendicular connectors connecting around 128 Billion memory cells (16 Gigabytes per chip).  This “3D” method is the reason why Optane based devices have 10x times the density of conventional solutions. Like DRAM, Optane memory is stackable in nature. One of the biggest changes in this technology however is that it eliminates the need for transistors – accessing the memory cells by varying the voltage sent to the particular sector. Basically, using the bulk of the material itself.
Intel 3D XPoint DIMMs
More details about 3D XPoint technology include:
  • Cross Point Array Structure – Perpendicular conductors connect 128 billion densely packed memory cells. Each memory cell stores a single bit of data. This compact structure results in high performance and high-density bits.
  • Stackable – In addition to the tight cross point array structure, memory cells are stacked in multiple layers. The initial technology stores 128Gb per die across two memory layers. Future generations of this technology can increase the number of memory layers, in addition to traditional lithographic pitch scaling, further improving system capacities.
  • Selector – Memory cells are accessed and written or read by varying the amount of voltage sent to each selector. This eliminates the need for transistors, increasing capacity while reducing cost.
  • Fast Switching Cell – With a small cell size, fast switching selector, low-latency cross point array and fast write algorithm, the cell is able to switch states faster than any existing non-volatile memory technology today.
Intel 3D XPoint Technology
“This is a huge performance improvement,” Krzanich said. “I think all of us, for any kind of I/O operations, that could see a 5X to 8X improvement in speed – that’s what we have been looking for. It is an improvement in both performance and latency. But there is really more to this technology. Intel Optane SSDs provide about 200X less variability, and that is an additional benefit that you can count on for your datacenter.”
By variability, we presume that Krzanich means that the average latencies will coalesce around a certain figure and not wander too much with jitter from outliers that have much longer latencies. As we have pointed out time and again here at The Platform, raw performance often matters for lots of scale-out, scale-up, and scale-in workloads, but consistency of performance often matters more. Raw performance is not much good if you can’t count on it. The idea is to do more transactions with a higher consistency, said Krzanich, with improved response times, and ultimately it will end with better user experiences for applications.
“We have been real careful to not show this with slides, but with working demos, because I want people to get excited and realize that this is coming,” he said. “This isn’t five years from now, this isn’t two years from now. This is next year, and this is going to transform how we think about data and memory and storage.” via theplatform
Intel 3D XPoint Optane DIMMs
The destructively powerful, 3D XPoint memory will make its way to the market in 2016. Currently Intel cannot tell a more specific timeframe but Intel will have Optane DIMM samples for early testers marking Intel’s return in the memory scape. These new DIMMs will provide the performance of fast DDR4 devices with the capacity and cost of NAND flash based products and will allow 6 TB of addressable memory inside a 2-socket server.

Intel 3D XPoint Based Optane DIMMs:

AMD Zen Based Flagships: ‘Summit Ridge’ CPU and ‘Raven Ridge’ APU Spotted in AIDA64 Changelog

You might remember the report from a couple of days back which stated that AMD’s Zen core has taped out. As it turns out, the much fabled Zen core is finally entering the realm of us mortals because AIDA64 has just updated their program with preliminary information about Zen based APUs and CPUs. This basically confirms what we have known for a while: that Zen based processors (both in APU and CPU flavors) are landing on the sub 20nm FinFET node fairly soon.
AMD Zen Featured 2Not an official slide. @AMD Public Domain

AMD’s Zen based Summit Ridge x86 processor and Raven Ridge APU in the pipeline – spotted on AIDA64

A little context might be prudent here. Summit Ridge and Raven Ridge are code-names that have been leaked multiple times in the past in various leaked slides (whose authenticity was never proven), and while it is possible that the final name turns out to be slightly different – the platform itself clearly exists. The Summit Ridge platform is the mainstream desktop platform of Zen processors having 8 cores a pop. Note that we are talking about full fledged SMT cores here and not the older styled CMT-based cores favored in the older FX processors. The socket stated on the slides was FM3 (which is now known as AM4).
Interestingly the AIDA64 change log also mentions Raven Ridge, the APU platform with Zen based cores. The platform is supposed to land about the same time as Bristol Ridge (according to certain reports). Unlike Bristol Ridge APUs however, which feature Excavator based cores, Raven Ridge will be on the sub 20nm FinFET node; be that 16nm FinFET or 14nm FinFET. There isn’t any word on the performance difference (between the Excavator based Bristol Ridge and the Zen based Raven Ridge) however, although the former should have the initial edge due to product positioning and a mature node, with the latter targeting the low power and mobile market initially. Anyways, here is the relevant portion of the changelog:
AIDA64 v5.50.3604 Beta Relevant Changelog:
  • preliminary support for AMD Raven Ridge APU
  • preliminary support for AMD Summit Ridge CPU
It is worth nothing that AIDA64 records preliminary information about processors based on the Machine ID, so this just serves as a confirmation of the existence of said processors and platforms– and doesn’t necessarily prove the existence of a prototype in the wild. It is also an important milestone in the transition from being an idea on the drawing board to actually hitting the shelves. The new processors are supposed to increase IPC gains by 40% over the last generation and should, hopefully, see the compute side of AMD become competitive again. Not to mention that pretty much everything (financially speaking), for AMD, depends on Zen’s performance.
We had previously heard that AMD will be making a plethora of changes including changing to SMT and adopting a single FPU per core design – both things which will put it on track to be a competitive force with Intel processors. That’s not it either, Zen will be using a scheduling model that is similar to Intel’s and it will use specific hardware and simulation to define any needed scheduling or NUMA changes. It will also be ISA compatible with Haswell/Broadwell style of compute. It will bring various compiler optimisations, including GCC with target of SPECint v6 based score at common compiler settings. Benchmarking and performance compiler LLVM targets SPECint v6 rate score at performance compiler settings. Each Zen core will have access to 512KB of L2 cache and 4 Zen cores will share 8MB of L3 cache.

Apple’s Force Touch Is Going To Get Extremely Popular Amongst Smartphone Manufacturers In 2016

With the release of Apple’s innovative Force Touch tech that was incorporated in the company’s MacBook Air and Apple Watch, the company also decided to branch it out to its iPhone 6s and iPhone 6s Plus. The technology became so popular that Huawei Mate S also came with the same feature. Now, it turns out that this particular feature is about to get very popular when 2016 starts, because lots of manufacturers have started to take note of the functionality brought to you courtesy of Force Touch.
w

Lots Of Manufacturers Have Stepped In To Produce Force Touch Sensors – Several Smartphones To Sport The Feature In 2016

According to a source, more Android-based smartphone vendors are expected to incorporate both fingerprint and Force Touch sensors in their upcoming models when 2016 commences. Force Touch will no doubt present a more flexible way to perform tasks assuming its functionality has heavily improved in upcoming devices. Xiaomi Mi5, an upcoming flagship smartphone is expected to make use of the technology, along with a fingerprint sensor. However, we are not so sure if the feature will be referred to as Force Touch or something else entirely.
Additionally, Apple’s closest adversary in the smartphone market, Samsung is going to incorporate something similar to Force Touch in its upcoming Galaxy S7, thanks to collaborating with Synaptics. Additionally, IC design houses located in Taiwan and China are expected to thoroughly benefit from this influx of demand. Fingerprint sensors are going to be an omnipresent element in smartphones, including entry-level ones, while Force Touch is expected to be a part of high-end smartphones during the start of next year. Side by side, NFC will also start to become an increasingly popular component in smartphones since it can be used to facilitate mobile payments.
ww
Since fingerprint scanners are not exactly foolproof when it comes to preserving the security of the user, it falls upon NFC to make transactions much more secure as compared to users connected to Wi-Fi networks. Taiwan-based IC vendors ranging from Egis Technology, Elan Microelectronics, and FocalTech Systems have started to ship out fingerprint scanners while Chinese-based companies such as Silead and Goodix have started to ship out minute volumes of the same sensors.
As for Force Touch sensors, FocalTech, Elan and Goodix have stepped into the market and have started to supply smartphone manufacturers with the components necessary to add another layer of functionality to mobile devices. Are you getting excited to see more and more of this tech present in upcoming handsets? Let us know your thoughts.

XFX Reintroduces Hawaii’s Infamous Blower Style Cooler For R9 390 Series Cards – Will It Handle Grenada Based R9 390X and R9 390?

Back in June, AMD launched a revised version of their Hawaii core known as Grenada which was featured on the new Radeon R9 390 series cards. Better in every possible way, the Grenada based cards feature impressive performance and are highly competitive against the Maxwell GM204 series cards. We have seen some really good custom cards based on the Grenada core but XFX made an interesting decision a few days ago to feature a cooler which we all remember from the previous R9 290 series cards.

Hawaii’s Blower Style Coolers Now Featured on Grenada R9 390 Series Cards From XFX

Known mostly for its poor performance on the Radeon R9 290 Hawaii cards, the blower style cooler did look very impressive during its launch back in 2013. Being a totally new design over the previous 7000 series and featured on AMD’s Sea Islands family, the blower style cooler was not properly optimized for a chip as big as the Hawaii GPU which resulted in poor temperatures and the cards were blistering past the 90C barrier (95C full load temperatures). Furthermore, the blower fan was loud using either ‘Quiet’ or ‘Uber’ mode profiles so they made little sense aside from upping the clock speeds a bit. This only meant that the card would have to throttle during gaming loads, not maintaining a constant clock speed unlike its direct competitor, the GTX 780 Ti at that time.
GTX 780 Ti vs R9 290X
Overall, the cards featured a good punch of performance but were affected by poor cooling and noise output. The issues for Radeon R9 290 series was resolved after AMD gave the greenlight to their AIBs to release custom variants of the card featuring better cooling and superior PCBs.
XFX’s decision to reintroduce the Hawaii cooler on Grenada based cards is very interesting. XFX currently offers several custom variants of the Radeon R9 390 series cards but Hawaii style versions could mean slightly lower manufacturing price at the cost of slightly higher temperature and possibly a bit more noise unless XFX added a few tweaks of their own to the cooler. The design of the cooler is kept the same with the red and black feature all over the shroud which represents AMD. The dual slot compartment houses the vapor chamber block that is cooled down by a single blower style fan and heat is pushed out from the front exhaust vent. Now that AMD’s Grenada has launched in the market with a tweaked design over Hawaii, we will definitely see lower temps on R9 390 series cards even when they use the blower style cooler.

AMD Radeon R9 390 Series

The AMD Radeon R9 390 series consists of two cards, the Radeon R9 390X and the Radeon R9 390. Starting off with the top end AMD Radeon R9 390X, we are looking at the Grenada XT (Hawaii XT) core with 2816 stream processors, 176 TMUs and 64 ROPs. The card features a clock speed of 1050 MHz and has the 8 GB GDDR5 VRAM clocked at 1500 MHz that runs across a 512-bit wide I/O interface and pushes out 384 GB/s bandwidth. The card is powered by a 6+8 Pin configuration and will be available at retail with a price of $429 US. The second card is the Radeon R9 390 which comes with the Grenada Pro (Hawaii Pro) core with 2560 SPs, 160 TMUs and 64 ROPs. The card has clock speeds of 1000 MHz core, 1500 MHz memory clock (6.0 GHz QDR) and has 384 GB/s bandwidth output. The card is priced at $329 US. The cards have Dual – Link DVI, HDMI and a single Display connector for display ports. Both cards have a 275W TDP and are powered by a 8+6 Pin power configuration.


Kirin 950 Release Date Confirmed Through Poster – Will Heat Things Up For Samsung And Qualcomm

We have heard great things about Huawei’s upcoming flagship chipset, Kirin 950 and it looks like we will not have to wait any longer because the SoC is closer to its release date than you think.
Kirin 950 Release Date Confirmed Through Poster – Will Heat Things Up For Samsung And Qualcomm

Kirin 950 Going To Be Announced In November – Qualcomm And Samsung Better Prepare Themselves

According to a source, there was a poster (image given below) suggesting that the upcoming chipset was going to be officially during the month of November. Huawei is most likely going to make the announcement on November 5, since that is date that has been listed on the image. Additionally, the chipset itself is going to be real powerhouse thanks to leaked benchmarking results that were posted by us a while back. The results displayed that Kirin 950 was a force to be reckoned with and even Samsung’s Exynos 7420 was not going to be match for it.
This is because the chip is running a two quad-core processors in ARM’s big.LITTLE architecture, and their details have been posted below.
  • Quad-core Cortex-A72 running at 2.4GHz
  • Quad-core Cortex-A53 running at 2.0GHz
With this much firepower, you can rest assured that the device running the chipset is not going to be any slouch when it comes to performance. From what we have reported so far, Kirin 950 is going to be present inside the company’s P9, and we cannot wait to see how it performs when pitted against the remaining high-end smartphones. Moreover, Kirin 950 will also feature two co-processors, and their details have been summarized below.
  • A dedicated DSP audio co-processor called a Tensilica Hi-Fi 4 DSP, to satisfy audio quality and performance.
  • i7 (not to be confused with Intel’s Core-i7), which will act as a sensor, connectivity, and security hub, and will take care of the less intensive tasks in order to provide more breathing room for the primary octa-core CPU.
Huawei-HiSilicon-Kirin-950-leaked-specs-1
Kirin 950 will also be providing support for dual-channel LPDDR4 RAM, UFS 2.0, and eMMC 5.1 storage, and just so you know, these happen to be the latest version amongst their respective categories. Before we forget, smartphone camera aficionados are going to have the time of their lives with future Huawei handsets because Kirin 950 will also support up to 42MP camera sensors. Additionally connectivity options include a Category 10 LTE modem, USB 3.0 and last but certainly not least, Bluetooth 4.2.
Huawei
Are you guys excited for the announcement of Huawei’s flagship chipset? We certainly are.

The Technomancer Official Gameplay Trailer Showcases Impressive Fighting and Crafting Systems

Focus Home Interactive has released a new trailer for Spiders’ latest RPG, The Technomancer. The “First Contact”, gives us a detailed look inside some of the fighting systems and environments of the Technomancer, planned for an early 2016 release for the PlayStation 4, Xbox One and PC.
The Technomancer

The Technomancer features three dynamic combat styles

The first look into The Technomancer gives us a glimpse of the three dynamic combat styles:
  • Staff: Highly mobile long-ranged melee to hit multiple targets.
  • Rogue with knife and gun: Agile, mobile, with dodges, rolls, and effective CC with the gun.
  • Protection with mace and shield: Parry, block, and beat them to death with powerful attacks!
Each of the combat styles can be imbued with electrical Technomancer powers, buffing their damage, as well as Zachariah being able to directly use his skills in battle, electrocuting, knocking out in stealth, and pounding back his foes on the Red Planet.

The Technomancer’s deep crafting system changes both the visible and active qualities of clothing & weapons

The video, shows Zachariah fighting and exploring Noctis, one of many cities of The Technomancer, where “over a hundred years of separation from Earth, new cultures, clans, and super-powers formed throughout Mars, causing clashes and in-fighting across the red planet”.
The Technomancer also features a deep, modular crafting system which changes both the visible and active qualities of clothing and weapons accumulated from scrap collected.
Cut off from Earth for 120 years, Mars is a world in conflict, with many different cultures and communities – and the games weapons and clothing reflect this quality, with jury rigged and make-shift weapons and armor, designed for survival, or militaristic rule!
Skills and abilities can be unlocked and upgraded in the ability tree, granting access to the three combat styles, your technomancer abilities as you level up and gain XP. With up to five different ways to complete quests, The Technomancer, offers choices that affect the development of the story.
The Technomancer is coming early 2016 to the PlayStation 4, Xbox One, and PC. We will bring you any new information as soon as it becomes available.

Download tvOS Final Version For Apple TV 4 – Direct Link

Apple has released the final version of tvOS (9.0) and is available to download for Apple TV 4 devices.
Apple TV 4
The Apple TV 4 goes on sale today the world over and the company has released the final version of tvOS to everyone in the nick of time. The final version of tvOS carries the same build number as the GM release which was pushed to developers a week back.
Although the tvOS firmware is useless to those who are going to buy a fresh unit today, but if you’re a developer and happen to have tvOS beta installed on your hardware, then you might want to update to the final build today to get to grips with the benefits of the full and final stable build of the software.
Screen Shot 2015-10-30 at 5.21.13 PM
If you grabbed yourself an Apple TV 4 and have managed to botch the software using a method unknown to mankind, then you might want to download the final tvOS firmware file as well to restore things to their factory state, and of course, start all over again. But given Apple’s track record of creating rock solid software for its hardware, we doubt that point will ever come in your day to day usage.
The Apple TV 4 is Cupertino’s new take on its already-existing set-top box lineup by taking things up a notch with new features such as Siri, dedicated App Store, gaming and whatnot. It remains to be seen whether or not the company’s new hardware will be an instant hit in the living room space.
Screen Shot 2015-10-30 at 5.21.48 PM
Given Apple’s dedication to a certain product, there’s a high chance that the new Apple TV 4 will be an instant hit among users who are looking for a quick fix device for the living room where they can consume content without diving into the world of complications. After all, the Apple TV 4 does come with a bunch of pre-loaded services such as Netflix, Hulu and whatnot, and what better way to end your day by checking out some new TV show episodes or your favorite movies, right? That too on a device that’s super easy to use.
You can grab the tvOS final version from this link. We recommend that you download the firmware file anyways and keep it stored somewhere for safekeeping.
If you did happen to pre-order an Apple TV 4 for yourself and got your unit ahead of time, then do not forget to let us know about it in the comments section below.