After Samsung already got two clients (Apple and Qualcomm) to use the company’s 14nm FinFET technology, the company is also looking to secure another partnership, but as competition from TSMC gets tougher with each passing day, the South Korean tech firm is forced to make some quick decisions.
Samsung Reducing Its 14nm FinFET Prices In Order To Secure Partnership With HiSilicon
According to a source, Samsung is offering HiSilicon lower prices for its 14nm FinFET production in an attempt to snare a large percentage of the fabless semiconductor manufacturing firm’s orders. The company has also decided to go down this route because HiSilicon also happens to be TSMC’s client, which will no doubt be offering lower prices for its 16nm FinFET technology. Unfortunately, TSMC was not able to comment about the current situation because the firm does not usually speak about speculations concerning customers and their orders.
Samsung’s superior manufacturing process had already attracted the attention of large companies like Apple and Qualcomm after the Galaxy smartphone manufacturing company had reportedly reduced production prices for it. Keep in mind that Samsung has already provided the technology to Qualcomm with which it will roll out its Snapdragon 820, the company’s upcoming flagship chipset. 14nm FinFET technology was also used in making Apple’s A8 and A9 SoCs.
In order to secure additional orders in the foreseeable future, Samsung and TSMC are currently battling it out on who will be the first manufacturing company to release a substantial yield of 10nm FinFET chips. Rumor has it that since TSMC was the one who manufactured a large portion of Apple’s A9 chipset, the California based tech giant has made a deal with the Taiwanese company in mass producing 100 percent of the company’s A10 chips. Even though it is far too early for the company to reach such a decision as this, we are confident that in the later months we will have more information if Apple has more than one manufacturer.
With Samsung and HiSilicon partnering together, we are sure that superior mobile SoCs from the latter will be produced and incorporated in Huawei’s upcoming smartphones. Kirin 950 is the Chinese firm’s flagship chipset and has been manufactured on the 16nm FinFET process so it is highly likely that its successor is going to be fabricated on Samsung’s 14nm FinFET process. We will be providing you with timely updates so stay tuned for more.
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